d a t a sh eet product speci?cation supersedes data of 1999 feb 10 1999 nov 15 discrete semiconductors BYD127 ultra fast low-loss rectifier b ook, halfpage m3d121
1999 nov 15 2 philips semiconductors product speci?cation ultra fast low-loss recti?er BYD127 features glass passivated high maximum operating temperature low leakage current excellent stability available in ammo-pack smallest surface mount rectifier outline. description cavity free cylindrical glass sod87 package through implotec ? (1) technology. this package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. (1) implotec is a trademark of philips. handbook, 4 columns mam061 ka fig.1 simplified outline (sod87) and symbol. limiting values in accordance with the absolute maximum rating system (iec 134). electrical characteristics t j =25 c unless otherwise speci?ed. symbol parameter conditions min. max. unit v rrm repetitive peak reverse voltage - 200 v v r continuous reverse voltage - 200 v i f(av) average forward current t tp = 145 c; averaged over any 20 ms period; see figs 5 and 6 - 1a t tp =95 c; averaged over any 20 ms period; see figs 5 and 6 - 2a i fsm non-repetitive peak forward current t = 10 ms half sinewave; v r =v rrmmax - 25 a t stg storage temperature - 65 +175 c t j junction temperature - 65 +175 c symbol parameter conditions max. unit v f forward voltage i f = 1 a; see fig.2; t j = 150 c; 0.8 v i f = 1 a; see fig.2 0.93 v i r reverse current v r =v rrmmax ; see fig.3 2 m a v r =v rrmmax ; t j = 150 c; see fig.3 50 m a t rr reverse recovery time when switched from i f = 0.5 a to i r =1a; measured at i r = 0.25 a 25 ns
1999 nov 15 3 philips semiconductors product speci?cation ultra fast low-loss recti?er BYD127 thermal characteristics note 1. device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 3 40 m m, see fig.7. for more information please refer to the general part of the associated handbook . symbol parameter conditions value unit r th j-tp thermal resistance from junction to tie-point 30 k/w r th j-a thermal resistance from junction to ambient note 1 150 k/w
1999 nov 15 4 philips semiconductors product speci?cation ultra fast low-loss recti?er BYD127 graphical data fig.2 forward current as a function of forward voltage; typical values. handbook, halfpage 02 10 0 2 mgr648 4 6 8 0.4 0.8 1.2 1.6 v f (v) i f (a) t j = 175 c 100 c 25 c fig.3 reverse current as a function of reverse voltage; typical values. handbook, halfpage 200 80 0 160 40 120 10 2 10 1 10 - 1 10 - 2 10 - 3 mgr651 i r ( m a) v r (v) t j = 175 c 100 c 25 c fig.4 diode capacitance as a function of reverse voltage; typical values. handbook, halfpage mgr639 10 2 10 1 11010 2 t j = 25 c v r (v) c d (pf) fig.5 maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). handbook, halfpage 0 200 4 0 1 mgr643 2 3 40 80 120 160 t tp ( c) i f(av) (a)
1999 nov 15 5 philips semiconductors product speci?cation ultra fast low-loss recti?er BYD127 fig.6 maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current. handbook, halfpage 02 0 1 mgr654 2 3 0.4 0.8 1.2 1.6 p (w) a = 3 2.5 2.0 1.57 1.42 i f(av) (a) msb213 4.5 2.5 1.25 50 50 fig.7 printed-circuit board for surface mounting. dimensions in mm.
1999 nov 15 6 philips semiconductors product speci?cation ultra fast low-loss recti?er BYD127 package outline definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. references outline version european projection issue date iec jedec eiaj sod87 100h03 99-03-31 99-06-04 hermetically sealed glass surface mounted package; implotec tm(1) technology; 2 connectors sod87 unit d mm 2.1 2.0 2.0 1.8 3.7 3.3 0.3 d1 h l dimensions (mm are the original dimensions) h d d 1 ll (2) 0 1 2 mm scale notes 1. implotec is a trademark of philips. 2. the marking indicates the cathode. ka
1999 nov 15 7 philips semiconductors product speci?cation ultra fast low-loss recti?er BYD127 notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 1999 68 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 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